For selective soldering, MEC uses two latest generation machines configured with both a lead free and a leaded beth. Both solutions exploit the soldering by means of selective mini-wave with soldering nozzles of different sizes based on the complexity of the board and the density of the components. This type of soldering allows mass production and NPI with maximum flexibility. Its strengths are:
the selective application of the flux with quantities calibrated according to the processed product
best cleaning of the board at the end of the process
the possibility of having quality solders with better repetitiveness than manual soldering
the extreme precision of thermal transfer
MEC selective soldering allows the client to count on a customized system, capable of working even complex products.
